Bridgelux begins volume shipment of fifth-generation LED chip
Bridgelux says that it has developed advanced chip technology and low cost-per-lumen products without resorting to complex, low yield thin-film techniques. LED maker Bridgelux has announced commercial availability of its new NLX-5 high-power gallium nitride (GaN) LED chip. As Bridgelux's fifth-generation chip, the NLX-5 offers a 15-20 percent performance improvement over its predecessors.
The company says that its chip, when embedded in a customer's standard, cool white LED package, provides a typical light output of 85?C90 lumens at 350 mA current.
Bridgelux says that it continues to improve the performance of its LED chips based on a low-cost manufacturing technology that has been abandoned by others in the industry in favor of thin-film LED architectures. These are, says Bridgelux, ultimately more complex and costly .
The thin-film approach, which is used by Osram, Lumileds and Cree among others, involving the growth of LED chip structures on a starting substrate such as sapphire or silicon carbide, followed by the removal of this substrate.
"By merging our innovative chip designs with traditional sapphire-based LED chip architectures, we've increased LED performance on a very robust, high-yield technology platform," said Bridgelux's Director of R&D, Steve Lester.
"Many companies have believed that high-light extraction was only possible with the removal of the sapphire substrate. Our team has pushed the technology to achieve higher performance without sapphire removal and its typically negative impact upon yield and cost.
Lester also said that, based on current R&D results, the company projects that after later this year it can provide an additional 10-15 percent improvement, utilizing this same high-power LED technology platform. Further performance improvements are predicted over the next 12 months .
Bridgelux believes that the NLX-5 chip will enable its customers to offer low cost-per-lumen LED packages, which in turn will help to speed market adoption of solid-state lighting applications into the general lighting market.
The company says that its chip, when embedded in a customer's standard, cool white LED package, provides a typical light output of 85?C90 lumens at 350 mA current.
Bridgelux says that it continues to improve the performance of its LED chips based on a low-cost manufacturing technology that has been abandoned by others in the industry in favor of thin-film LED architectures. These are, says Bridgelux, ultimately more complex and costly .
The thin-film approach, which is used by Osram, Lumileds and Cree among others, involving the growth of LED chip structures on a starting substrate such as sapphire or silicon carbide, followed by the removal of this substrate.
"By merging our innovative chip designs with traditional sapphire-based LED chip architectures, we've increased LED performance on a very robust, high-yield technology platform," said Bridgelux's Director of R&D, Steve Lester.
"Many companies have believed that high-light extraction was only possible with the removal of the sapphire substrate. Our team has pushed the technology to achieve higher performance without sapphire removal and its typically negative impact upon yield and cost.
Lester also said that, based on current R&D results, the company projects that after later this year it can provide an additional 10-15 percent improvement, utilizing this same high-power LED technology platform. Further performance improvements are predicted over the next 12 months .
Bridgelux believes that the NLX-5 chip will enable its customers to offer low cost-per-lumen LED packages, which in turn will help to speed market adoption of solid-state lighting applications into the general lighting market.
SMD: It is an abbreviation of Surface Mounted Devices. It is one of Surface Mount Technology (SMT) components. In the initial stage of circuit board production, through - hole assembly is completely manual. When the first automated machines were introduced, they could place some simple pin elements, but complex elements still needed to be placed manually for reflow soldering. Surface Mounted components mainly include rectangular chip components, cylindrical chip components, composite chip components and special-shaped chip components
Surface Mounted Devices
Changzhou Changyuan Electronic Co., Ltd. , https://www.changyuanelectronic.com