Causes and solutions to the missing parts of the red plastic board during wave soldering Analysis and answers
In the SMT chip process, the red glue process is often used to complete the process. However, when the red glue process components are mounted in the wave soldering process, the electronic components (especially the glass diodes) often encounter the problem of missing components, as SMT engineers. In fact, it is a very distressing problem. Now Xiaobian has made a detailed analysis and solution for the reasons for the missing parts and the solutions for the red plastic board during wave soldering.
Analysis of the reasons for losing the red rubber sheet:
1. If the patch element and PCB board's green oil (solder-proof oil) fall off together, it means that the PCB board itself has a problem (the adhesion of green oil is not enough);
2. To see if there is any scratch on the position where the PCB board components fall out. The scratched position of the PCB board component will also make the adhesion of the green oil insufficient.
3, to see whether the PCB board chip components out of the law, if it is a fixed number of patch components out, you have to consider whether the hole is blocked red plastic steel mesh, red plastic volume is too little or red plastic in the backflow Solder curing time is not enough;
4, SMD components fall, but the red glue is still stuck to the top, the reason is: patch components have problems (SMT components surface treatment problems, such as release agent, etc., affect the red glue attached Focus on
5, SMD components out of the regular, red plastic steel mesh plug, too little plastic volume;
6. If there is no regular out of SMD components, you have to consider whether the viscosity of the red glue is not enough, the red glue has expired, and the red glue's time for rewarming is not enough.
7, SMD components in the transport process, such as (glass diodes), which requires the PCB board placed, can not be stacked, the use of bubble bags or other buffer packaging materials packaging circuit board to avoid components collide with each other Drop out
8, SMD components fall because: PCB board storage time is too long, generally need to tin after seven days after the patch, if more than the time, red plastic will slowly lose the sticky and unstable paste to produce bad parts.
Electronic product manufacturing companies or electronic patch processing plants can perform wave soldering on the products before comprehensive wave soldering of the red rubber board according to the above eight reasons. This can greatly avoid over-spinning of red plastic boards. The odds of losing the parts increase the efficiency of production and reduce the rate of defective products.
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