[Golden Globe Award] Technology is maturing, Jingke Electronics won the Golden Globe Award in CSP Device category
[Text / high-tech LED Zhao Hui] As LED packaging competition continues to intensify, LED packaging companies are experiencing the dilemma of gross profit reduction, and the compression of profit margins has led many companies to increase the development of new technologies and processes to reduce Cost increases profits.
CSP is becoming an important fulcrum for packaging companies to improve their profits.
The most representative is Jingke Electronics (Guangzhou) Co., Ltd. It is reported that Jingke Electronics is based on the company's own gold-free packaging technology platform, using APT patented technology - flip-chip soldering technology, to achieve single-chip and multi-chip module gold-free, no solid crystal plastic package, with high light Many excellent features such as efficiency and high reliability.
In the recent 2015 Golden Globe Awards, Jingke Electronics won the Golden Globe Award in the CSP device category, and Hongli Optoelectronics and Tiandian Optoelectronics also entered the award together.
It is understood that Jingke Electronics' award-winning 5050 device, 3-7W specification can achieve 120lm/W, which can completely replace the COB solution, and the customer cost savings can reach more than 20%. At the same time, the 5050 device has higher brightness than the mature product 3030, enabling a smaller area of ​​high luminous flux output.
The CSP technology introduced by Jingke Electronics adopts the mature flip chip and packaging technology platform, which can perfectly solve the phenomenon that the chip and the substrate CTE are not matched, and adopts the precise and mature phosphor coating technology to ensure the consistency of light color. A wide range of CSP products are available depending on the optical design needs.
“CSP is currently suitable for the backlight and general lighting market due to its small size, large illumination angle, high current drive, excellent heat dissipation and high reliability. At the same time, CSP has begun to emerge in the large-size backlight market throughout 2015. With its supporting lens resources approaching maturity, CSP is expected to be the perfect solution for direct-lit backlights,†said Xiao Guowei, president of Jingke Electronics.
"The market share of flip-chip LED chips will expand in the future, and will be close to 30% in 2016. Flip-chip technology combined with packaging technology can perfectly realize the vertical integration of upstream and downstream technologies, shorten the industrial chain, reduce costs, and realize chip-scale packaging (CSP). ) The mainstream technology route." Xiao Guowei said.
Compared with the traditional PPA/PCT/EMC bracket type SMD products, CSP products have good heat dissipation effect, can achieve ultra-high current drive, ensure long-term work reliability, and have a large single light output, which is suitable for direct-type backlight to reduce the number of beads. And the need to reduce costs, but also easier to achieve uniform distribution of light when the Lamp beads are large, to meet the requirements of reducing the number of beads.
"In the future, with the maturity of 8-inch silicon wafer technology, the cost of CSP light source will drop rapidly, and it is expected to be applied to the general lighting market in batches in 2016." Xiao Guowei concluded.
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