Phenolic Paper Insulation Board Bakelite Plate for Jig Fabrication

April 11, 2024

Model NO.: PR-BAK-1
Classification: Inorganic Insulation Material
Color: Orange&Black
Brand: Prior
Thickness: 3-50mm
Size: 1040*2080mm
Density: 1.45g/cm3
FOB Port: Shenzhen
Sample Availability: Yes
Small Order: Accepted
Lead Time: 7 Working Days
Trademark: PRIOR
Transport Package: by Plastic Pallet or Wooden Pallet
Specification: SGS, RoHS
Origin: China
HS Code: 3920940000
Model NO.: PR-BAK-1
Classification: Inorganic Insulation Material
Color: Orange&Black
Brand: Prior
Thickness: 3-50mm
Size: 1040*2080mm
Density: 1.45g/cm3
FOB Port: Shenzhen
Sample Availability: Yes
Small Order: Accepted
Lead Time: 7 Working Days
Trademark: PRIOR
Transport Package: by Plastic Pallet or Wooden Pallet
Specification: SGS, RoHS
Origin: China
HS Code: 3920940000
Phenolic Paper Insulation Board Bakelite Plate For Jig Fabrication

Description
Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used industrial laminated sheet.

Chacteristics
-Good electrical properties
-Good mechanical properties
-No water absorption
-High temperarture resistance
-Good surface hardness 
-Abrasion resistance
-Good insulation

Applications
1.PCB fixture, ICT fixture,pads of drilling machine
2.Gear,motor,generator,transformer,fixture inverter
3.Switch,electric insulation part

Technical data sheet
PROPERTIES Method of Verification Unit Value
I.Physical Properties
Density ISO 1183 g/cm3 1.45~1.5
Water absorption 24hrs ISO 62 % <1.6
II.Thermal Properties 
Max. service temperature -Short term ISO 75-2 ºC 300
Max. service temperature - Long term ISO 75-2 ºC 140
Heat deflection temperature-HDT/A ISO 75-2 ºC 150
Coefficient of liner thermal expansion ISO 11359 10-4*K-1 10
Thermal Conductivity ISO 11359 W/(K*m) /
Flammability UL 94 Class HB
III.Mechanical Properties      
Tensile strength at yield ISO 527-2 MPa ≥100
Tensile strength at break ISO 527-2 Mpa /
Hardness Rockwell ISO2039-2   115~118
Hardness Shore-D DIN 53505   98
Impact strength ISO 179 kJ/m2 67
Bending Strength ISO 527-2 Mpa ≥120
Elongation at break ISO 527-2 % ≥0.03
Warping Degree ISO 179 ‰ <0.3
IV.Electrical Properties
Volume resistively  IEC 60093 Ohm (Ω) * cm 10^7~10^8
Surface resisively  IEC 60093 Ohm (Ω) ≥1.0x103
Breakdown Voltage-CW VDE 0303 kV 10
Arc resistance VDE 0303 S /
NOTE: 1 g/cm3 = 1,000 kg/m3, 1 Mpa = 1 N/mm2, 1kV/mm = 1 MV/m
Statement:      
Property data contained herein are typical values of resin for your reference and comparison purposes only. PRIOR will not provide any legally binding guarantee of certain properties, or any suitability. 

  Phenolic Paper Insulation Board Bakelite Plate For Jig Fabrication

Description
Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used industrial laminated sheet.

Chacteristics
-Good electrical properties
-Good mechanical properties
-No water absorption
-High temperarture resistance
-Good surface hardness 
-Abrasion resistance
-Good insulation

Applications
1.PCB fixture, ICT fixture,pads of drilling machine
2.Gear,motor,generator,transformer,fixture inverter
3.Switch,electric insulation part

Technical data sheet
PROPERTIES Method of Verification Unit Value
I.Physical Properties
Density ISO 1183 g/cm3 1.45~1.5
Water absorption 24hrs ISO 62 % <1.6
II.Thermal Properties 
Max. service temperature -Short term ISO 75-2 ºC 300
Max. service temperature - Long term ISO 75-2 ºC 140
Heat deflection temperature-HDT/A ISO 75-2 ºC 150
Coefficient of liner thermal expansion ISO 11359 10-4*K-1 10
Thermal Conductivity ISO 11359 W/(K*m) /
Flammability UL 94 Class HB
III.Mechanical Properties      
Tensile strength at yield ISO 527-2 MPa ≥100
Tensile strength at break ISO 527-2 Mpa /
Hardness Rockwell ISO2039-2   115~118
Hardness Shore-D DIN 53505   98
Impact strength ISO 179 kJ/m2 67
Bending Strength ISO 527-2 Mpa ≥120
Elongation at break ISO 527-2 % ≥0.03
Warping Degree ISO 179 ‰ <0.3
IV.Electrical Properties
Volume resistively  IEC 60093 Ohm (Ω) * cm 10^7~10^8
Surface resisively  IEC 60093 Ohm (Ω) ≥1.0x103
Breakdown Voltage-CW VDE 0303 kV 10
Arc resistance VDE 0303 S /
NOTE: 1 g/cm3 = 1,000 kg/m3, 1 Mpa = 1 N/mm2, 1kV/mm = 1 MV/m
Statement:      
Property data contained herein are typical values of resin for your reference and comparison purposes only. PRIOR will not provide any legally binding guarantee of certain properties, or any suitability. 

 

D-Subminiature Connectors

The D-subminiature or D-sub is a common type of electrical connector. They are named for their characteristic D-shaped metal shield. When they were introduced, D-subs were among the smallest connectors used on computer systems.

A D-sub contains two or more parallel rows of pins or sockets usually surrounded by a D-shaped metal shield that provides mechanical support, ensures correct orientation, and may screen against electromagnetic interference. The part containing pin contacts is called the male connector or plug, while that containing socket contacts is called the female connector or socket. The socket's shield fits tightly inside the plug's shield. Panel mounted connectors usually have threaded nuts that accept screws on the cable end connector cover that are used for locking the connectors together and offering mechanical strain relief. Occasionally the nuts may be found on a cable end connector if it is expected to connect to another cable end. When screened cables are used, the shields are connected to the overall screens of the cables. This creates an electrically continuous screen covering the whole cable and connector system.

ANTENK offers one of the most comprehensive lines of high reliability D-Subminiature connectors available for military, avionics, space and high reliability industrial applications.


Features of ANTENK D-Subminiature Connectors


  1. Standard density d-subminiature connectors
  2. High density d-subminiature connectors, contacts are available as well as several custom and combination versions.
  3. All d-subminiature connectors may be manufactured with crimp, solder cup, straight PCB and right angle PCB terminations (except solder cup terminations on High Density configurations).





Ragne of of ANTENK D-Subminiature Connectors

Standard Density solder cup, stamped & formed contact D-subminiature connectors

High Density solder cup, stamped & formed contact D-subminiature connectors
Standard Density solder cup,machined contacts D-subminiature connectors
High Density solder cup,machined contacts D-subminiature connectors
crimp & load D-subminiature connectors
IDC D-subminiature connectors
Standard Density vertical mount D-subminiature connectors
High Density vertical mount D-subminiature connectors
Standard Density right angle D-subminiature connectors
High Density right angle D-subminiature connectors
surface mount D-subminiature connectors
Slim D-sub series
D-subminiature connectors stacked D-sub series



D-Subminiature Connectors

ShenZhen Antenk Electronics Co,Ltd , https://www.pcbsocket.com

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