Semiconductor Manufacturing Technology Enters 3D 2013 for Mass Production

The timing is about to enter 2012, the semiconductor industry technology continues to change, in which 3DIC will be the future chip development trend, will prompt the supply chain into 3DIC research and development, which Intel (Intel) believes that process technology will enter 3D, is bound to inspire itself Process innovation. In addition, when semiconductor companies expect that 3DIC will have a chance to produce a large amount of production in 2013, 2013 is also expected to be the first year of 3DIC production.

3DIC is the chip development trend in the future, and its new architecture has brought about great changes. Intel believes that process technology will enter into 3D, and the future is bound to inspire technological innovation. Intel Labs recently announced cooperation with the ITRI to jointly develop a memory technology with low power consumption in the 3DIC architecture. This technology will be used in mobile devices such as Ultrabooks, tablet computers, and smart phones in the future, as well as one trillion Exascale and CloudMega-DataCenters.

The ITRI believes that Intel owns a number of technical patents, which are combined with the 3DIC research and development foundation of the ITRI. It should enable Taiwan’s industry’s key autonomous technologies to further drive the development of related industrial chains.

The industry of the packaging and testing industry believes that the semiconductor supply chain has recently accelerated its investment in 3DIC R&D. Many manufacturers have joined the R&D supply chain, including fabs and packaging and testing plants. The research and development expenses of 3DIC are much higher than those of 2010. This is a good thing for the development of the 3D industry. It is expected that the 3DIC should expect to see a large amount of production in 2013 and it should be regarded as the first year of mass production of 3DIC.

Sun Moonlight pointed out that the interface standard for logic and memory chips, namely WideI/OMemoryBus, was settled at the end of September and hundreds of semiconductor members were added. This will help accelerate the development schedule of manufacturers and promote the early development of 3DIC. Production.

In 2011, Licheng completed the transformation of the R&D center and business unit organization, and established wafer-scale packaging, 3DIC advanced process and product research and development pilot plants in the Hsinchu Science Park, and also began construction of the 3DIC advanced process mass production plant. The chairman of the company, Cai Yugong, believes that 3DG such as TSV will be mass-produced in 2013.