With the continuous development of science and technology, especially information technology, the process technology of printed board production is correspondingly improved to meet the needs of different users. In recent years, the development of communications, automobiles and other fields has been very rapid, and the demand for printed boards has undergone some changes. The demand for high-power printed boards and high-frequency microwave boards has increased. Many CEOs of printed board manufacturers are optimistic about this growth point, but how to do high-frequency microwave board, enterprises must practice internal strength. I will talk about the problems that I should encounter in the production of high-frequency microwave plates.
Second, the basic requirements of high frequency microwave board1. When designing the substrate, the telecommunications engineer has selected the specified dielectric constant, dielectric thickness, and copper foil thickness according to the actual impedance requirements. Therefore, when accepting the order, it must be carefully checked and must meet the design requirements.
2, transmission line production accuracy requires high-frequency signal transmission, the characteristic impedance of the printed conductor is very strict, that is, the production accuracy of the transmission line is generally ±0.02mm (±0.01mm transmission line is also very common), transmission line The edges should be very neat, and tiny burrs and gaps are not allowed.
3. The plating layer requires that the characteristic impedance of the high-frequency microwave board transmission line directly affects the transmission quality of the microwave signal. The characteristic impedance has a certain relationship with the thickness of the copper foil. Especially for the hole metallized microwave plate, the thickness of the coating not only affects the thickness of the total copper foil, but also affects the accuracy of the wire after etching the etched room. Therefore, the thickness of the plating layer And uniformity, to be strictly controlled.
4. Requirements for mechanical processing First, the material of the high-frequency microwave board and the epoxy glass cloth material of the printed board are greatly different in machining; secondly, the processing precision of the high-frequency microwave board is higher than that of the printed board. Many, the general shape tolerance is ± 0.1mm (the high precision is generally ± 0.05mm or 0 ~ -0.1mm).
5, the requirements of the characteristic impedance has been talked about the characteristics of the impedance, it is the most basic requirements of high-frequency microwave board, can not meet the requirements of the characteristic impedance, everything is in vain.
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