Dialog Semiconductor Co., Ltd. has announced the launch of the world's first real-time processing chip for 2D/3D image conversion: DA8223. The chip provides real-time conversion of 2D/3D video images to various portable devices, including smartphones and tablets. The device also integrates a parallax barrier screen driver that allows users to watch 3D content without the need for eyeglasses.

The chip analyzes each frame of the 2D video image and creates a layered depth map (Z-depth) by separating the foreground image from the background image. Thus, each original image pixel is mapped to the left eye and the right eye, and the 3D image effect can be directly rendered when viewed through a display with a parallax barrier. The DA8223 integrates a complete 2D/3D image conversion algorithm. Compared with traditional software-based solutions, the chip does not impose additional burden on the main application processor in 2D/3D image conversion and does not require external memory. .

“At present, the demand for experiencing 3D image effects on smartphones has arrived, but there are currently very few 3D-effect video contents. By using the DA8223, it is possible to create a truly unique and immediately available solution without affecting battery life. Users experience devices with unlimited 3D content,” said Mark Tyndall, vice president of enterprise development and strategy at Dialog Semiconductor.

"The DA8223 is the first hardware-based solution to solve 2D/3D image conversion technology optimized for various portable devices. It does not actually require software development, and it is based on the use of application processor-based software implementation. In comparison, its demand for battery and computing power is minimal,” Mark added.

By supporting 60 frames per second of video and images, the system can display 3D content in landscape and portrait formats in real time. The DA8223 ensures a richer and more comfortable 3D viewing experience for content that is actually 2D, even in super. Used for a long time.

The DA8223 is compatible with the widest range of 3D-capable displays, from 3.8-inch smartphones to 10-inch tablets. It can also work with any display device equipped with a parallax barrier, including OLEDs and from Sharp's latest TFT display.

This 5x5mm, 81-ball UFBGA package can be mounted on a printed circuit board, between the application processor and the 3D display, or COF technology installed on the display module. Samples of this device will be available beginning in 2011, ensuring that the handheld products will be mass-produced in the second half of 2011.