Secret CC256x intelligent Bluetooth driver circuit design
The TICC256x device is a complete Bluetooth BR/EDR/LEHCI solution that reduces design effort and enables rapid time to market. Based on TI's seventh-generation Bluetooth core, the device implements a proven solution that supports the Bluetooth 4.0 Dual Mode (BR/EDR/LE) protocol. TI's power management hardware and software algorithms save significant power consumption in all widely used Bluetooth BR/EDR/LE mode operations. When coupled with an MCU device, this HCI device provides the industry's best RF performance for mobile phone accessories, sports and fitness applications, and wireless audio solutions.
A schematic diagram of the CC256x device reference is shown. TI's complete circuit diagram and PCB layout guidelines.
With transmission power and receive sensitivity, this solution offers approximately 2x the industry's best range compared to other BLE-only solutions. A copyright-free software Bluetooth stack from TI is pre-integrated with TI's MSP430 and Stellaris MCUs. TI's partner, Stonestreet One, also provides this stack through MFi solutions and other MCUs. Some of the configurations currently supported include: Serial Port Configuration (SPP), Advanced Audio Distribution Configuration (A2DP), and several BLE configurations (which vary depending on the supported MCU).
Different from traditional FR-4 (plastic), ceramic materials have good high-frequency performance and electrical properties, and have properties that organic substrates do not have, such as high thermal conductivity, excellent chemical stability and thermal stability. Ideal packaging material for large scale integrated circuits and power electronic modules.
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