Dozens of domestic heat dissipation materials brands will be unveiled at 2013 Gaogong LED Lighting Exhibition

[Text / high-tech LED reporter Gao Jinyu] In the past few years, the heat dissipation problem has been plaguing the development of the industry, because the heat dissipation effect directly affects the service life of the LED, especially the high-power LED application is the key link.

Whether it is LED light source, LED power supply or LED whole light, various manufacturers are constantly looking for various methods to solve heat dissipation. Among them, there are some domestic manufacturers specializing in the research and development of thermal materials occupying the mainstream of the market.

On the heat-dissipating materials, Tang Haihong, director of R&D Center of Foshan Kangrong (Booth No. 1C05a), exhibitor of 2013 Gaogong LED Lighting Exhibition, said: “The future radiator materials will show the three pillars of metal, plastic and ceramics, no matter which material will be used. Towards the direction of low cost, mass production, and standardization."

Since the beginning of this year, the strong demand for LED lighting terminal market has also driven the rapid growth of market demand for lighting and cooling kits. 2013 Hi-Tech LED Lighting Exhibitor Jin Hongmao (Booth No.: 2M17) Marketing Manager Yan Shuai said that the domestic LED lighting and cooling kit market manufacturers are numerous, but the general scale is not large, and the workshop-type roughing-type enterprises are mostly.

Especially in the context of increasingly fierce market competition, it is more important to establish a brand with quality. 2013 Gaogong LED Lighting Exhibitor Feitai Technology (Booth No.: 1F04) Yang Tao, vice president of sales, believes that there are still some problems in the LED lighting industry. First, there are too many participants, and the industry has a serious situation of mixed fish and fish. There are very few dragons. Second, the industry standards are missing, it seems that the products are varied, but only limited to the improvement of the appearance. Third, there is a lack of innovation in the industry, and there is no real bright spot.

This also gives many companies a rare opportunity to create LED cooling brands.

From November 25th to 27th, 2013, as the largest professional LED lighting exhibition in China in the second half of this year, the 2013 Gaogong LED Lighting Exhibition carefully selected several domestic heat-dissipating materials to represent the brand manufacturers.

Overclocking three (Booth No.: IC04) relies on the heat dissipation technology and core patent accumulated on PC products to make great efforts in high-power LED heat dissipation, including HDT heat pipe direct contact technology with patented invention and FIN fin connection technology.

Puwan Optoelectronics (Booth No.: 2F14) is the first company in China to develop and apply thermal plastics to LED bulb lamps.

Huiyitong (Booth No.: 2M09) specializes in supplying high-quality cold forging radiators for LED lighting manufacturers positioning high-end markets.

There is also an integrated plastic tube of Xinlong Optoelectronics (Booth No. 2A02), a new radiator material with a "core" patented radiator from Zhejiang Hengjie (Booth No. 2M62), and a new heat-dissipating material from Jiangmen Longmei (Booth No. 2M67). Ceramic heat sink expert Planck (Booth No.: 2M75) and other brand manufacturers will present different exciting for professional buyers.

The unique positioning of the high-tech LED lighting exhibition is to provide a platform for the LED lighting supply chain and lighting brand.

2013 Gaogong LED Lighting Exhibition radiator exhibitors (as of November 16, 2013)


Exhibitors position number
Xinlong Optoelectronics 2A02 Xinlong will bring the integrated plastic tube to the 2013 High-tech LED Lighting Exhibition
Overclocking three IC04 Overclocking three with the latest high-power cooling kit unveiled at 2013 Gaogong LED Lighting Exhibition
Xi Yuemei 2B16
Jin Hongmao 2M17 Jin Hongmao will bring a variety of new lighting kits to the 2013 High-tech LED Lighting Exhibition
Hui Yitong 2M09 Huiyitong will bring the cold forging integrated radiator to the 2013 High-tech LED Lighting Exhibition
Guoyan High Energy 2M63
Puwan Optoelectronics 2F14 Puwan Optoelectronics will bring thermal plastic lamps to the 2013 High-tech LED Lighting Exhibition
Zhejiang Hengjie 2M62 Zhejiang Hengjie will carry the "core" patented radiator to debut at the 2013 High-tech LED Lighting Exhibition
Long Meiya 2M67 Longmeiya will bring its own research and development of new heat-dissipating materials to the 2013 High-tech LED Lighting Exhibition
Planck 2M75 Ceramic heat sink expert Planck will debut at the 2013 High-tech LED Lighting Exhibition
Feitai Technology 1F04
Foshan Kangrong 1C05a Ceramic cooling solution provider Kang Rong will debut at the 2013 High-tech LED Lighting Exhibition

More exhibitors will be subject to the November 25th 2013 High-tech LED Lighting Exhibition.

USB 3.0 Hubs

USB3.0 provides a standard interface for all kinds of devices that are connected to PCS or audio/high-frequency devices.The theoretical transmission speed is up to 5Gbps. HUB is commonly known as a hub, which is used to connect multiple computers or network devices in a network using a star topology. The USB 3.0 Hubs is an upgrade of the USB 2.0 Hubs. The transmission rate of the USB2.0 is 480Mbps, and the transmission rate of the USB3.0 is 5Gbps. The maximum transmission speed is 10 times that of the USB2.0, and the transmission speed is faster.

The USB 3.0 hub provides a quick and easy way to connect all the peripherals you use on your desktop. You can connect 2 external monitors, gigabit Ethernet ports, headphones/speakers, USB printers and scanners, keyboards, mice and other peripherals with a single USB 3.0 cable to your computer for up to 5Gbit/s external storage access (10 times faster than USB 2.0). USB HUBS can do split, but not evenly. If, as the subject says, you only have two devices, and the two devices are transmitting at the same time and taking up as much bandwidth as possible, then you end up with two devices each taking up 50% of the bandwidth. Due to the fast theoretical speed of USB3.0, even if divided into four parts, the theoretical bandwidth of each port is still as high as 1Gbps, and the number of converted bytes is close to 100MB/s, which is still a very high bandwidth.


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