The mainstream process of CSP observation market "big secret"

CSP stands for Chip Scale Package, which means chip-scale packaged device, which refers to a packaged device with a package size smaller than 1.2 times the chip size. The current industry is based on the constant cost of high-cost, CSP is therefore regarded as a "savior" to change the industry.

According to the research data of the High-Technology Research Institute LED Research Institute (GGII), the global LED lighting market is growing steadily. It is expected that the market size in 2016 will increase from US$25.7 billion in 2015 to US$30.5 billion, and the penetration rate of LED lighting will also increase. It will increase from 31% in 2015 to 36%.

On the one hand, the LED lighting market, which has a rising penetration rate, is on the one hand, and the price has fallen sharply to the tragic situation of “selling on the pound”. The importance of cost-effective killing is particularly prominent.

The high-tech LED visit survey found that many domestic enterprises are developing CSP technology more or less based on different starting points. For example, at present, only based on incomplete statistical data, there are 15 kinds of known process methods in the market. Among them, various subdivision technologies can also be described as complicated and complicated.

High-tech LEDs also specifically summarize the mainstream practices in the market. In general, CSP process technology is divided into two categories: front-end and back-end.

“The front-end is mainly focused on the two mainstream technologies of dusting and laminating. For example, Samsung used laminating film before, and the domestic DHL used in the CSP field used to spray powder,” said Cheng Shengpeng, general manager of stereo optoelectronics.

According to Xiaobian, the dusting technology is relatively simple, also known as the glue-filling structure. Its five sides are uniformly illuminated, and it is pressed by silica gel phosphor. It has high light efficiency, but it is also without imperfections. It has the top and the surrounding. Color temperature consistency control is poor.

The lamination technology, also known as the phosphor film structure, uses the surrounding titanium dioxide to protect the fluorescent film. Only the top one emitting surface, the light uniformity and directivity are good, but the relative lack of light is lost. Output, light efficiency will be low, the current industry is known that Samsung is using this technology.

“Fluorescent coating is currently becoming the bottleneck of the LED industry. The existing phosphor coating technology faces cost and performance bottlenecks: first, the phosphor is ceramic particles, and the cost is high; second, the color conversion is very good for the phosphor quality and coating process. Sensitive." Zhu Bo, general manager of Xingjia Optoelectronics mentioned.

"In addition to these two mainstream forms, there is also a form of 'flip chip + fluorescent film + transparent silica gel'. The four sides of the chip and the front side of the chip are evenly coated with phosphor, and then added on the front surface. Transparent silica gel is fixed, the light color uniformity is the best, but the process requirements are the most complicated. Currently, only Philips is used in the market." Cheng Shengpeng revealed.

In addition, there are some products on the market that are also called CSP with a substrate. Although it can also be small in size, this is not the final form. At best, it is only a transitional product.

"Obviously, these types of methods are more flexible, can be arbitrarily combined into a variety of power and serial number, reduce the amount of brackets and silicone, reduce the packaging, and therefore cost-effective than traditional devices." Wang Gaoyang, marketing director of Hongli Optoelectronics, said.

In the back-end process, CSP mainly includes two main processes: solid crystal and patch. For example, the solid crystal link, the current market mainstream is mostly in the form of brush solder paste and eutectic, among which, eutectic Due to the excessive investment, there are few companies in the market that will be put into use.

“In the back-end processing flow, it is worth mentioning that the placement efficiency is still a problem, and the equipment of the patch factory cannot handle such a small particle.” Wang Gaoyang mentioned.

Industry experts also pointed out that, relatively speaking, in the future, CSP will be converted to blue film technology, and it will be a trend to stick to the substrate with a placement machine.

"CSP was first used in the field of backlights and flashlights. At present, Apple and Samsung's mobile phone flashes use CSP unpackaged structure, while Samsung and LG's ultra-thin TV parts use CSP unpackaged chips." Dr. Liu Guoxu, President/CTO, mentioned.

However, in the lighting industry, CSP is small in size and high in flexibility. Although the current popularity is not high, it can be expected that its application range will become more and more extensive.

Industry experts predict that the future replacement of traditional LEDs by CSP will focus on the following three application areas:

The first type can directly replace medium power and high power;

The second, multi-matrix arrangement replaces the COB, but at present due to the problem of the spacing of the bead, it is temporarily unable to meet the small-angle spotlight with particularly high spot requirements;

The third, CSP plus lens, to replace the low power inside the panel light.

"The current domestic CSP chip factory, the low-power products below 1W, the parameter performance is difficult to be satisfactory, the performance-price ratio is not as good as the 1W product. The foreign brand price in this field will be higher, but in reality, the market situation is power. The smaller the CSP, the higher the price/performance ratio, which is the direction for the next step in the domestic CSP product promotion." Cheng Shengpeng said.

Xiaobian also learned that the current low-power CSP market, the international enterprise represented by Samsung, the product parameters have been very stable, the field of 0.5W level bulbs, with the gradual improvement of stability, the amount It will be getting bigger and bigger.

"In the past, the source of CSP products was too small, and the price was high. At present, domestic manufacturers are expected to quickly start at the end of this year after initially grasping the front-end and back-end markets." Wang Gaoyang finally mentioned.

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